Breadboards & PCB Substrate

PCB prototyping materials: solderless breadboards in 170, 400, 830 tie-point sizes, perforated solderable perf boards in various sizes, copper-clad FR-4 substrate (single- and double-sided) in 1.0, 1.5, 2.0 mm thickness, laser-transfer toner, ferric chloride etchant. Filter by size, layer count, copper thickness (18, 35, 70 μm), and type. Used for prototyping new devices, student education, and home reproduction of designs followed by PCB fabrication.